The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Jan. 30, 2012
Applicants:

Xiangdong Chen, Irvine, CA (US);

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong HU, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Inventors:

Xiangdong Chen, Irvine, CA (US);

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong Hu, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance.


Find Patent Forward Citations

Loading…