The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Feb. 24, 2012
Applicants:

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong HU, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Xiangdong Chen, Irvine, CA (US);

Inventors:

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong Hu, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Xiangdong Chen, Irvine, CA (US);

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/552 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01);
Abstract

There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, an interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer.


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