The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Dec. 29, 2011
Applicants:

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong HU, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Xiangdong Chen, Irvine, CA (US);

Inventors:

Sam Ziqun Zhao, Irvine, CA (US);

Kevin Kunzhong Hu, Irvine, CA (US);

Sampath K. V. Karikalan, Irvine, CA (US);

Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);

Pieter Vorenkamp, Laguna Niguel, CA (US);

Xiangdong Chen, Irvine, CA (US);

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/326 (2006.01); H01L 23/495 (2006.01); H05K 1/11 (2006.01); B82Y 99/00 (2011.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H05K 1/029 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0248 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/104 (2013.01); H05K 2203/105 (2013.01); H01L 23/49822 (2013.01); H01L 21/485 (2013.01); H01L 21/486 (2013.01);
Abstract

An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.


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