San Jose, CA, United States of America

Charles Gerard Woychik

USPTO Granted Patents = 125 


 

Average Co-Inventor Count = 4.1

ph-index = 25

Forward Citations = 2,547(Granted Patents)

Forward Citations (Not Self Cited) = 2,492(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Endicott, NY (US) (1991 - 1993)
  • Broome, NY (US) (1999 - 2003)
  • Vestal, NY (US) (1996 - 2006)
  • Nishkayuna, NY (US) (2011)
  • Niskayuna, NY (US) (2008 - 2021)
  • San Jose, CA (US) (2007 - 2022)

Company Filing History:


Years Active: 1991-2022

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Areas of Expertise:
Integrated Circuits
3D Ic Packaging
Heat Dissipation
Microelectronic Components
Interposer Solutions
Conductive Vias
Low Cte Interposer
Hybrid Interposer
Device Assembly
Thermal Conductivity
Cavity Structures
Demountable Interconnect
125 patents (USPTO):Explore Patents

Title: Charles Gerard Woychik: Revolutionizing Innovation in IC Packaging

Introduction:

Throughout his illustrious career, Charles Gerard Woychik has emerged as a prominent figure in the world of innovation. With groundbreaking inventions, successful product developments, and collaborations with industry leaders, Woychik's contributions have left an indelible mark. This article will explore his remarkable career highlights, including his latest patents, significant collaborations, and his pivotal role in advancing integrated circuit (IC) packaging technology.

Latest Patents:

Woychik's recent patents have unveiled his pioneering work in the field of integrated interposer solutions for 2D and 3D IC packaging. These patents introduce innovative methodologies, techniques, and structures aimed at enhancing the performance, efficiency, and reliability of electronic devices. By integrating interposer technology, these solutions enable improved thermal conductivity, reduced die warpage, and overall optimized packaging.

Career Highlights:

Throughout his career, Woychik has amassed an impressive total of 125 patents, solidifying his position as a leading innovator. His expertise lies in the realm of IC packaging, where he has consistently pushed the boundaries of what is possible. From developing new manufacturing techniques to conceptualizing novel packaging solutions, Woychik's contributions have played a pivotal role in the evolution of IC packaging.

Collaborations:

Woychik's career has been enriched by collaborations with renowned companies such as Invensas Corporation and International Business Machines Corporation (IBM). Through these partnerships, he has had the opportunity to collaborate with talented individuals who share his passion for innovation. Notably, his collaboration with Cyprian Emeka Uzoh and Arkalgud R Sitaram has yielded remarkable results and facilitated the development of cutting-edge technologies.

Conclusion:

Charles Gerard Woychik's career embodies the spirit of innovation and the relentless pursuit of excellence. His groundbreaking inventions and successful product developments have advanced the field of IC packaging. By collaborating with industry leaders and continuously pushing the boundaries, Woychik has left an indelible mark on the world of innovation. As his journey continues, we eagerly anticipate the next chapter in his remarkable career, and the groundbreaking contributions he will undoubtedly make to the domain of technology and beyond.

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