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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10177086 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Apr. 13, 2018

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Cyprian Emeka Uzoh, San Jose, CA (US);

Charles G. Woychik, San Jose, CA (US);

Arkalgud R. Sitaram, Cupertino, CA (US);

Hong Shen, Palo Alto, CA (US);

Zhuowen Sun, Campbell, CA (US);

Liang Wang, Milpitas, CA (US);

Guilian Gao, San Jose, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:

Haynes and Boone, LLP.

Primary Examiner:

Hsien Ming Lee

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 49/02 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 23/5226 (2013.01); H01L 28/60 (2013.01); H01L 2924/0002 (2013.01);
Abstract

In a microelectronic component having conductive vias () passing through a substrate () and protruding above the substrate, conductive features (E.A,E.B) are provided above the substrate that wrap around the conductive vias' protrusions (') to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.

Find Patent Forward Citations

Uzoh, Cyprian. (2019). Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates (U.S. Patent No. 10177086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10177086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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