Zhuowen Sun

This inventor holds 44 USPTO granted patents and 5 published patent applications, primarily in Microelectronic Packaging. Top assignees: Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Technologies LLC, Other. Active years: 2015-2025.

USPTO Granted Patents = 44 (Patent Applications = 5)

% Patents Active = 88.6

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 219(Granted Patents)

Company Filing History:

42 out of 1,908

Adeia Semiconductor Bonding Technologies Inc.

patents

1 out of 32

Adeia Semiconductor Technologies LLC

patents

1 out of 834,453

Other

patents

Years Active: 2015-2025

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Areas of Expertise:

Microelectronic Components

Wire Bond Wires

Interference Shielding

Ultra High Performance Interposer

High-Bandwidth Memory

Embedded Wire Bonds

Circuit Assemblies

Package-on-Package

Signal Equalization

Memory Module

Flexible I/O Partition

TFD I/O Partition

44 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12255153 - Wire bond wires for interference shielding (2025-03-18),

2. 11810867 - Wire bond wires for interference shielding (2023-11-07),

3. 11462483 - Wire bond wires for interference shielding (2022-10-04),

4. 10700002 - Ultra high performance interposer (2020-06-30),

5. 10559537 - Wire bond wires for interference shielding (2020-02-11),

6. 10522457 - Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates (2019-12-31),

7. 10354976 - Dies-on-package devices and methods therefor (2019-07-16),

8. 10332833 - Ultra high performance interposer (2019-06-25),

9. 10325877 - Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces (2019-06-18),

10. 10177086 - Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates (2019-01-08),

11. 10115678 - Wire bond wires for interference shielding (2018-10-30),

12. 10103093 - Via structure for signal equalization (2018-10-16),

13. 10032715 - Ultra high performance interposer (2018-07-24),

14. 10026467 - High-bandwidth memory application with controlled impedance loading (2018-07-17),

15. 10007622 - Method for reduced load memory module (2018-06-26),

Title: Inventor Zhuowen Sun: Revolutionizing Technology in Campbell, CA

Introduction: Zhuowen Sun is a visionary inventor based in Campbell, CA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Zhuowen Sun holds several patents in the areas of artificial intelligence, computer vision, and machine learning, showcasing his expertise and forward-thinking approach to technological advancements.

Career Highlights: With a career spanning over two decades, Zhuowen Sun has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have reshaped industries.

Collaborations: Throughout his career, Zhuowen Sun has collaborated with top researchers, engineers, and innovators, fostering a culture of creativity and excellence in the projects he undertakes.

Conclusion: Zhuowen Sun's passion for innovation and his relentless pursuit of technological excellence continue to inspire the next generation of inventors and shape the future of technology in Campbell, CA and beyond.