The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Feb. 24, 2017
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Zhuowen Sun, Campbell, CA (US);

Cyprian Emeka Uzoh, San Jose, CA (US);

Yong Chen, Palo Alto, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 23/5384 (2013.01); H01L 23/53238 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01);
Abstract

An apparatus relating generally to a substrate is disclosed. In such an apparatus, the substrate has a first surface and a second surface opposite the first surface. The first surface and the second surface define a thickness of the substrate. A via structure extends from the first surface of the substrate to the second surface of the substrate. The via structure has a first terminal at or proximate to the first surface and a second terminal at or proximate to the second surface provided by a conductive member of the via structure extending from the first terminal to the second terminal. A barrier layer of the via structure is disposed between at least a portion of the conductive member and the substrate. The barrier layer has a conductivity configured to offset a capacitance between the conductive member and the substrate when a signal is passed through the conductive member of the via structure.


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