The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

Aug. 21, 2017
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Bong-Sub Lee, Mountain View, CA (US);

Cyprian Emeka Uzoh, San Jose, CA (US);

Charles G. Woychik, San Jose, CA (US);

Liang Wang, Milpitas, CA (US);

Laura Wills Mirkarimi, Sunol, CA (US);

Arkalgud R. Sitaram, Cupertino, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 1/09 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/112 (2013.01); H05K 1/113 (2013.01); H05K 1/165 (2013.01); H05K 3/188 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/5313 (2015.01);
Abstract

Interposer circuitry () is formed on a possibly sacrificial substrate () from a porous core (') covered by a conductive coating (″) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.


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