Average Co-Inventor Count = 4.4

ph-index = 25

Forward Citations = 2,530(Granted Patents)

Inventors with similar research interests:

Location History:

Tokyo, JP (1987)
Kanagawa, JP (1994 - 1995)
Yokosuko, JP (1995)
Yokohama, JP (1991 - 2002)
Kanagawa-ken, JP (1997 - 2008)
Yokosuka, JP (1995 - 2013)

Company Filing History:

65 out of 52,711

Kabushiki Kaisha Toshiba

patents

4 out of 10,295

Tokyo Electron Limited

patents

3 out of 1,479

Ibiden Company Limited

patents

4. 1 out of 71

Tokyo Electron Yamanashi Limited

6. 4 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1987-2013

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Areas of Expertise:

Reliability Evaluation

Multichip Semiconductor Device

Electrolytic Treatment

Probe Pin Testing

Damascene Technique

Laser Beam Machining

Chemical Mechanical Polishing

Integrated Circuit Manufacturing

Stacked Circuit Device

CVD Apparatus

Passive Semiconductor Device

Pattern Forming Method

70 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8456186 - Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method (2013-06-04),

2. 8283755 - Multichip semiconductor device, chip therefor and method of formation thereof (2012-10-09),

3. 8174093 - Multichip semiconductor device, chip therefor and method of formation thereof (2012-05-08),

4. 7829975 - Multichip semiconductor device, chip therefor and method of formation thereof (2010-11-09),

5. 7387717 - Method of performing electrolytic treatment on a conductive layer of a substrate (2008-06-17),

6. 7335517 - Multichip semiconductor device, chip therefor and method of formation thereof (2008-02-26),

7. 7242206 - Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method (2007-07-10),

8. 7091733 - Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method (2006-08-15),

9. 7049223 - Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method (2006-05-23),

10. 7032307 - Method for fabricating a probe pin for testing electrical characteristics of an apparatus (2006-04-25),

11. 6977228 - Semiconductor device using damascene technique and manufacturing method therefor (2005-12-20),

12. 6946387 - Semiconductor device and method for manufacturing the same (2005-09-20),

13. 6933216 - Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same (2005-08-23),

14. 6933205 - Integrated circuit device and method of manufacturing the same (2005-08-23),

15. 6846750 - High precision pattern forming method of manufacturing a semiconductor device (2005-01-25),

Title: The Innovation Journey of Nobuo Hayasaka: Pioneering Reliability Evaluation in Semiconductors

Introduction: Nobuo Hayasaka, a prominent inventor based in Yokosuka, Japan, has left an indelible mark in the world of semiconductor technology with an impressive portfolio of 70 patents. His groundbreaking work in reliability evaluation has significantly advanced the field, with notable contributions in multichip semiconductor devices.

Latest Patents: Among his latest patents is a reliability evaluation test apparatus that revolutionizes the assessment of interconnection and insulating films on semiconductor wafers. This apparatus features innovative elements such as a hermetic and heat-insulating structure, a pressure mechanism, and a heating mechanism for accelerated testing under high temperatures. Additionally, his work on multichip semiconductor devices introduces a novel approach to chip stacking using connect plugs for electrical connections between chips.

Career Highlights: Nobuo Hayasaka has made substantial contributions to the field of semiconductor technology through his work at Kabushiki Kaisha Toshiba and other leading companies. His expertise in reliability evaluation and semiconductor device design has earned him recognition as a trailblazer in the industry. With 70 patents to his name, he continues to push the boundaries of innovation in the semiconductor sector.

Collaborations: Throughout his career, Nobuo Hayasaka has collaborated with esteemed colleagues such as Katsuya Okumura and Haruo Okano. Their combined efforts have led to breakthroughs in semiconductor device technology, paving the way for enhanced performance and reliability in modern electronic systems.

Conclusion: In conclusion, Nobuo Hayasaka stands as a visionary inventor whose ingenuity has shaped the landscape of semiconductor technology. His relentless pursuit of innovation and dedication to pushing the boundaries of reliability evaluation have cemented his legacy as a true pioneer in the field. With a rich portfolio of patents and a history of fruitful collaborations, Nobuo Hayasaka continues to inspire future generations of inventors in the ever-evolving world of semiconductor technology.

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