The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Aug. 01, 2003
Junji Kunisawa, Kanagawa-ken, JP;
Mitsuko Odagaki, Kanagawa-ken, JP;
Natsuki Makino, Kanagawa-ken, JP;
Koji Mishima, Kanagawa-ken, JP;
Kenji Nakamura, Kanagawa-ken, JP;
Hiroaki Inoue, Tokyo, JP;
Norio Kimura, Kanagawa-ken, JP;
Tetsuo Matsuda, Gunma-ken, JP;
Hisashi Kaneko, Kanagawa-ken, JP;
Nobuo Hayasaka, Kanagawa-ken, JP;
Katsuya Okumura, Kanagawa-ken, JP;
Manabu Tsujimura, Kanagawa-ken, JP;
Toshiyuki Morita, Kanagawa-ken, JP;
Junji Kunisawa, Kanagawa-ken, JP;
Mitsuko Odagaki, Kanagawa-ken, JP;
Natsuki Makino, Kanagawa-ken, JP;
Koji Mishima, Kanagawa-ken, JP;
Kenji Nakamura, Kanagawa-ken, JP;
Hiroaki Inoue, Tokyo, JP;
Norio Kimura, Kanagawa-ken, JP;
Tetsuo Matsuda, Gunma-ken, JP;
Hisashi Kaneko, Kanagawa-ken, JP;
Nobuo Hayasaka, Kanagawa-ken, JP;
Katsuya Okumura, Kanagawa-ken, JP;
Manabu Tsujimura, Kanagawa-ken, JP;
Toshiyuki Morita, Kanagawa-ken, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Kanagawa-Ken, JP;
Abstract
A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portionhorizontally holding and rotating a substrate with its surface to be plated facing upward. A seal materialcontacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrodepasses an electric current upon contact with the substrate. A cathode portionrotates integrally with the substrate holding portionAn electrode arm portionis above the cathode portionand movable horizontally and vertically and has an anodeface-down. Plating liquid is poured into a space between the surface to be plated and the anodebrought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.