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Ogaki-shi, Japan

Ibiden Company Limited

USPTO Granted Patents = 1,482

EPO Patents = 389

Trademarks = 6

Forward Citations = 10,913

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724 inventors (with patents filed for the assignee):

Motoo Asai (115 out of 115 patents)

Kazushige Ohno (103 out of 104 patents)

Takashi Kariya (97 out of 97 patents)

4. Toshiki Furutani (77 out of 77 patents)

5. Michimasa Takahashi (72 out of 72 patents)

6. Dongdong Wang (71 out of 72 patents)

7. Masafumi Kunieda (63 out of 63 patents)

8. Yasuji Hiramatsu (54 out of 54 patents)

9. Yasutaka Ito (50 out of 51 patents)

10. Yasushi Inagaki (45 out of 45 patents)

11. Kiyotaka Tsukada (44 out of 45 patents)

12. Yukinobu Mikado (39 out of 39 patents)

13. Hajime Sakamoto (37 out of 38 patents)

14. Masakazu Aoyama (36 out of 36 patents)

15. Kazutake Ogyu (35 out of 36 patents)

Core Competencies:

Wiring Substrate

Printed Wiring Board

Inorganic Fiber Mat

Antiviral Substrate

Antimicrobial Composition

Semiconductor Package

Heat Transfer Suppression Sheet

Inductor Built-In Substrate

Motor Coil Substrate

Exhaust Gas Purification Device

Battery Pack

Optical Waveguide

1,482 patents: Sort by Forward Citations

1. 12513828 - Method for manufacturing printed wiring board (2025-12-30),

2. 12507342 - Wiring substrate and method for manufacturing wiring substrate (2025-12-23),

3. 12495489 - Printed wiring board (2025-12-09),

4. 12484159 - Wiring substrate and method for manufacturing the same (2025-11-25),

5. 12477663 - Printed wiring board (2025-11-18),

6. 12477662 - Printed wiring board (2025-11-18),

7. 12476195 - Wiring substrate (2025-11-18),

8. 12428763 - Method of producing inorganic fiber mat and inorganic fiber mat (2025-09-30),

9. 12414231 - Printed wiring board (2025-09-09),

10. 12402248 - Wiring substrate (2025-08-26),

11. 12388025 - Wiring substrate (2025-08-12),

12. 12363827 - Printed wiring board and method for manufacturing printed wiring board (2025-07-15),

13. 12356557 - Method for manufacturing wiring substrate (2025-07-08),

14. 12336095 - Wiring substrate and method for manufacturing wiring substrate (2025-06-17),

15. 12317425 - Method for manufacturing printed wiring board and printed wiring board (2025-05-27),

Ibiden Co., Ltd. is a global technology company specializing in the production of electronics components and high-performance materials. With a strong focus on sustainability, Ibiden develops and manufactures products that contribute to a more environmentally friendly society. The company offers a wide range of innovative solutions, including printed circuit boards, ceramic products, and semiconductor packaging materials. Ibiden constantly strives to deliver cutting-edge technology and superior quality, earning them a trusted reputation among leading electronics manufacturers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

1,482 Patents

#1 in Ogaki-shi

#149 in Japan

#647 in the World

Ogaki-shi, Japan

Ibiden Company Limited

Forward Citations = 10,913

724 inventors:

Motoo Asai (115 out of 115 patents)

Kazushige Ohno (103 out of 104 patents)

Takashi Kariya (97 out of 97 patents)

4. Toshiki Furutani (77 out of 77 patents)

5. Michimasa Takahashi (72 out of 72 patents)

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