Ogaki, Japan

Toshiki Furutani

This inventor holds 83 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in Wiring Substrate (CPC class H05K). Top assignees: Ibiden Company Limited, Ibiden Corporation, Jsr Corporation. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshiki Furutani. Retrieved from https://idiyas.com/inventor/toshiki-furutani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 83 

% Patents Active = 95.2


Average Co-Inventor Count = 2.5

ph-index = 7

Forward Citations = 244(Granted Patents)

Forward Citations (Not Self Cited) = 222(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Ibi-gun, JP (2007 - 2013)
  • Gifu, JP (2012 - 2013)
  • Ogaki, JP (2009 - 2020)

Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Wiring Substrate
Printed Circuit Board
Semiconductor Package
Manufacturing Method
Multilayer Wiring Board
Electronic Component
Shield Cap
Built-In Capacitor
Conductor Post
Printed Wiring Board
Substrate
83 patents (USPTO):Explore Patents

Title: The Innovative Journey of Toshiki Furutani

Introduction

Toshiki Furutani is a prolific inventor based in Ogaki, Japan, known for his significant contributions to the field of wiring substrates. With an impressive portfolio of 74 patents, Furutani has made substantial advancements in electronic materials and configurations, enhancing the functionality and efficiency of electronic devices.

Latest Patents

Among Toshiki Furutani's latest inventions are two notable patents related to wiring substrates. The first patent describes a wiring substrate that includes a first conductor layer with wirings, an interlayer insulating layer covering the first conductor layer, a second conductor layer with wirings, and a via conductor penetrating through the interlayer insulating layer to connect both conductor layers. Additionally, this invention features an embedded wiring layer designed to fill grooves within the insulating layer. The interlayer insulating layer is composed of a laminated structure which improves performance and reliability.

The second patent also focuses on a wiring substrate, incorporating a first insulating layer, a conductor layer with dedicated pads, and a secondary insulating layer featuring openings to expose these pads. This design allows for metal posts to be formed on the first pads, facilitating a wiring structure that connects various components systematically. The innovative approach creates a versatile component mounting surface, optimizing electronic assembly.

Career Highlights

Throughout his illustrious career, Toshiki Furutani has worked with prominent companies such as Ibiden Company Limited and JSR Corporation. These experiences have not only expanded his technical expertise but also allowed him to contribute to cutting-edge projects in the electronics industry.

Collaborations

In his pursuit of innovation, Furutani has collaborated with skilled professionals like Takashi Kariya and Yukinobu Mikado. Working alongside these talented individuals has undoubtedly influenced his inventive process, leading to the development of groundbreaking technologies.

Conclusion

Toshiki Furutani's dedication to innovation is evident through his extensive patent portfolio and collaborative spirit. With each new invention, he continues to shape the future of electronic components, demonstrating the vital role of inventors in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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