The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Dec. 27, 2018
Ibiden Co., Ltd., Ogaki, JP;
Toshiki Furutani, Ogaki, JP;
Takema Adachi, Ogaki, JP;
Toshihide Makino, Ogaki, JP;
Yasushi Usami, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.