Toshihide Makino

Title: Innovations of Toshihide Makino

Introduction

Toshihide Makino is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrates and boards, holding a total of 15 patents. His work has been instrumental in advancing technology in this area.

Latest Patents

One of his latest patents involves a wiring substrate that includes a core layer and multiple conductor layers. These layers consist of inner, outer, and intermediate conductor layers, with interlayer insulating layers positioned between them. The design features a laminated structure that enhances the performance of the substrate. Another notable patent is for a wiring board that comprises a core substrate and build-up layers on both surfaces. Each conductive layer in these build-up layers includes a metal foil layer and a plating layer, with specific thickness requirements to optimize functionality.

Career Highlights

Toshihide Makino is associated with Ibiden Company Limited, where he has been able to apply his innovative ideas and technical expertise. His work has led to advancements in the manufacturing processes of wiring substrates and boards, making them more efficient and reliable.

Collaborations

Throughout his career, Makino has collaborated with notable colleagues such as Hidetoshi Noguchi and Takema Adachi. These partnerships have fostered a creative environment that has contributed to the development of cutting-edge technologies.

Conclusion

Toshihide Makino's contributions to the field of wiring substrates and boards have established him as a key figure in innovation. His patents reflect a commitment to enhancing technology and improving manufacturing processes.