The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Mar. 26, 2020
Ibiden Co., Ltd., Ogaki, JP;
Takenobu Nakamura, Ogaki, JP;
Takahiro Yamazaki, Ogaki, JP;
Takashi Yamauchi, Ogaki, JP;
Toshihide Makino, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate layers, second conductor layers including second inner, outer and intermediate layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the insulating layers such that each via conductor connects two conductor layers and is integrally formed with one of the conductor layers on side away from the core layer. The first and/or second inner conductor layers has a first conductor layer structure including metal foil and plating film layers, the first and/or second outer conductor layers has the first structure, the first and/or second intermediate conductor layers has a second conductor layer structure including metal foil and plating film layers, and the via conductors include a group integrally formed with the first structure and including constricted via conductors each having a constricted portion.