Ogaki, Japan

Takenobu Nakamura

This inventor holds 22 USPTO granted patents and 6 EPO patents, primarily in Wiring Substrates. Top assignees: Ibiden Company Limited, Omron Automotive Electronics Co., Ltd., Omron Corporation. Active years: 2009-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takenobu Nakamura. Retrieved from https://idiyas.com/inventor/takenobu-nakamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 72.7


Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 102(Granted Patents)


Location History:

  • Kani, JP (2012 - 2014)
  • Gifu, JP (2009 - 2018)
  • Ogaki, JP (2012 - 2022)

Company Filing History:


Years Active: 2009-2022

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Areas of Expertise:
Wiring Substrate
Printed Wiring Board
Multilayer Boards
Electric Motor Control
Motor Drive Device
Manufacturing Method
Controller
Multi-Phase Motor
22 patents (USPTO):Explore Patents

Title: Innovations by Takenobu Nakamura in Wiring Substrate Technology

Introduction

Takenobu Nakamura, a prolific inventor based in Ogaki, Japan, has made significant contributions to the field of wiring substrate technology. With a total of 22 patents to his name, Nakamura has established himself as a key figure in electronic component innovation, particularly in designing wiring substrates that enhance the performance and reliability of electronic devices.

Latest Patents

Nakamura's latest patents showcase his expertise in wiring substrate technology. One noteworthy patent describes a wiring substrate that consists of a core layer, first conductor layers (including a first inner conductor layer, first outer conductor layer, and first intermediate conductor layer), and second conductor layers (including a second inner conductor layer, second outer conductor layer, and second intermediate conductor layer). This invention incorporates interlayer insulating layers between the conductor layers and features a unique laminated structure for the inner and outer conductor layers, improving the overall performance of the substrate.

Another significant patent details a wiring substrate with a core layer and multiple conductor layers, similar to his previous invention. This design integrates via conductors in the core layer that decrease in diameter from one inner conductor layer to another, ensuring efficient signal transmission. The innovative use of laminated structures for both inner and outer conductor layers further enhances the substrate's functionality.

Career Highlights

Nakamura has worked with renowned companies such as Ibiden Company Limited and Omron Automotive Electronics Co., Ltd. These organizations are pivotal in the electronics manufacturing industry, and his tenure at these firms underscores his impactful contributions to technological advancements in wiring substrates and other electronic components.

Collaborations

Throughout his career, Nakamura has collaborated with esteemed professionals in the field, including Michimasa Takahashi and Masakazu Aoyama. Their collective expertise and insights have further propelled Nakamura's innovations, leading to advancements that are highly regarded within the industry.

Conclusion

Takenobu Nakamura's dedication to innovation in wiring substrate technology has led to the development of several essential patents that contribute significantly to electronics. His collaborations with leading professionals and his experience in reputable companies highlight his role as a pioneer in this specialized field. As technology continues to evolve, Nakamura's work will undoubtedly play a crucial part in shaping the future of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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