The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Mar. 24, 2020
Ibiden Co., Ltd., Ogaki, JP;
Takenobu Nakamura, Ogaki, JP;
Takahiro Yamazaki, Ogaki, JP;
Takashi Yamauchi, Ogaki, JP;
Toshihide Makino, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including a metal foil layer and a plating film layer, the first and/or second outer conductor layers has the first laminated structure, the first and/or second intermediate conductor layers has a second laminated structure including a metal foil layer and a plating film layer, and the first and second laminated structures are formed such that a surface of the second laminated structure on a side away from the core layer has unevenness smaller than unevenness of a surface of the first laminated structure on a side away from the core layer.