Ibiden Company Limited

Omron Automotive Electronics Co., Ltd.

Omron Corporation

Takenobu Nakamura

Michimasa Takahashi

Masakazu Aoyama

Yukinobu Mikado

Toshihide Makino

Takahiro Yamazaki

Takashi Yamauchi

Shinichi Kuratani

Michisada Yabuguchi

Hiroyuki Yanagisawa

Yasuhiro Watanabe

Masamitsu Hamasaki

Shinichi Togawa

Tetsuya Fukumoto

Koji Miura

Go Endo

A wiring substrate includes a core layer, first conductor layers including a first inner conductor layer, a first outer conductor layer and a first intermediate conductor layer, second conductor layers including a second inner conductor layer, a second outer conductor layer and a second intermediate conductor layer, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including a metal foil layer and a plating film layer, the first and/or second outer conductor layers has the first laminated structure, and the first and/or second intermediate conductor layers has a second laminated structure including a metal foil layer and a plating film layer and includes a conductor pattern formed such that an upper surface of the conductor pattern has an edge portion forming an inclined portion inclined toward the core layer.

Wiring substrate

A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the core layer such that each via conductor decreases in diameter from one of the inner conductor layers toward the other one of the inner conductor layers and that the other one of the inner conductor layers has thickness greater than thickness of the one of the inner conductor layers. The first and/or second inner conductor layers includes a first laminated structure including metal foil and plating film layers, the first and/or second outer conductor layers includes the first laminated structure, and the first and/or second intermediate conductor layers includes a second laminated structure including metal foil and plating film layers.

A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate layers, second conductor layers including second inner, outer and intermediate layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the insulating layers such that each via conductor connects two conductor layers and is integrally formed with one of the conductor layers on side away from the core layer. The first and/or second inner conductor layers has a first conductor layer structure including metal foil and plating film layers, the first and/or second outer conductor layers has the first structure, the first and/or second intermediate conductor layers has a second conductor layer structure including metal foil and plating film layers, and the via conductors include a group integrally formed with the first structure and including constricted via conductors each having a constricted portion.

A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including metal foil and plating film layers and includes first conductor pattern having a side surface curved toward inner side of the first pattern, the first and/or second outer conductor layers has the first laminated structure and includes the first conductor pattern having the side surface curved toward the inner side of the first pattern, and the first and/or second intermediate conductor layers has a second laminated structure including metal foil and plating film layers and includes second conductor pattern having a side surface curved toward outer side of the second pattern.

A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including a metal foil layer and a plating film layer, the first and/or second outer conductor layers has the first laminated structure, the first and/or second intermediate conductor layers has a second laminated structure including a metal foil layer and a plating film layer, and the first and second laminated structures are formed such that a surface of the second laminated structure on a side away from the core layer has unevenness smaller than unevenness of a surface of the first laminated structure on a side away from the core layer.

A lid has a fixing surface to be fixed to a metal board so that a metal surface, equipped with no components, of the metal board is in contact with the fixing surface, a through bore provided in laterally close proximity to the fixing surface and exposing mating parts of an external connector with which harnesses are mated, a fixing edge provided around the through bore and fixed to a housing of the external connector; and fixing pedestals projecting from a circumference of the fixing surface and fixed to the control board. A direction of connecting power supply terminals of the external connector to the metal board is a direction being perpendicular to the metal board. A direction of connecting the control board to signal terminals of the external connector is identical to the direction of connecting the power supply terminals to the metal board.

Electric motor control apparatus

A wiring board includes a substrate, pads formed on an electronic-component mounting surface of the substrate, and a resin insulation layer covering the electronic-component mounting surface and having opening portions such that the opening portions are exposing the pads, respectively. The pads include a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the opening portions are formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions.

Printed wiring board and method for manufacturing the same

A wiring board includes a core substrate including an insulating layer and a conductor layer formed on the insulating layer, and a build-up layer laminated on the substrate and including an inter-layer insulating layer and a conductor layer laminated on the inter-layer. The substrate has opening penetrating through the insulating layer such that surface of the conductor layer in the substrate is forming bottom of the opening, the substrate has a via conductor formed in the opening and including plating filling the opening, the conductor layer in the substrate includes a metal foil, the conductor layer in the build-up layer includes a metal foil, and the metal foil in the substrate has surface in contact with the surface of the insulating layer such that the surface of the metal foil in the substrate has surface roughness smaller than surface roughness of surface of the metal foil in the build-up layer.

Wiring board and method for manufacturing the same

A motor control apparatus has an inverter circuit having a plurality of pairs of upper and lower arms provided so as to correspond to the number of phases, and switching elements provided on each of the upper arms and the lower arms of each phase that drive a motor on the basis of ON or OFF operations of the respective switching elements, a single current detector that detects a current of the motor flowing through the inverter circuit, and a duty calculator that calculates duties of a PWM signals for turning the switching elements ON or OFF on the basis of a deviation between a current value of the current detected by the current detector and a target current value.

Motor control apparatus

A motor control device has a motor driving unit that drives a motor, a current detecting unit that detects a motor current flowing through the motor, a control unit that compares a detected current value of the motor current detected by the current detecting unit with a target current value to obtain a deviation, to control the motor driving unit based on the deviation, and a compensation unit that sets as a current offset value a detected current value of a drift current detected by the current detecting unit in a state where the motor current is regarded as zero, to compensate the detected current value of the motor current by the current offset value. The compensation unit sets a target offset value according to the current value of the detected drift current to correct the current offset value stepwise until the current offset value reaches the target offset value.

Motor control device

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder padB on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, landA in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Multilayer printed wiring board and manufacturing method of multilayer printed wiring board

A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 &#x3bc;m or less in thickness.

Multilayer printed wiring board

A motor drive device has a drive circuit for driving a motor, and a control section for controlling the drive circuit. The control section has a current command value calculating portion for calculating a current command value, a rotation calculating portion for calculating a rotation angle and an angular speed of the motor, a current command value correcting portion for correcting the current command value based on the rotation angle, a voltage command value calculating portion for calculating a voltage command value based on the current command value, a voltage command value correcting portion for correcting the voltage command value based on the current command value and the rotation angle and the angular speed, and a drive signal generating portion for generating a drive signal based on the voltage command value.

Motor drive device

A method of manufacturing multilayer printed wiring hoard in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. In the inventive method, no corrosion resistant layer is formed on a solder pad on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, a land in which the corrosion resistant layer is formed by the method is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Manufacturing method of multilayer printed wiring board

A motor drive device has a drive unit for driving a motor based on an ON/OF operation of a switching element by a PWM (Pulse Width Modulation) signal. The motor drive device uses a PWM control method and performs abnormal determination based on an application voltage value and an actual measurement voltage value of the motor. The motor drive device does not make a false determination of determining as abnormal when it is normal, when determining the presence of abnormality based on the application voltage value and the actual measurement voltage value of the motor.

Growing community of inventors

Ogaki, Japan

Takenobu Nakamura