The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Oct. 22, 2018
Ibiden Co., Ltd., Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A printed wiring board includes: a core substrate having a core layer and first and second conductor layers; a first build-up layer including a first insulating layer, an inner first conductor layer, an outermost first insulating layer, and an outermost first conductor layer; and a second build-up layer including a second insulating layer, an inner second conductor layer, an outermost second insulating layer, and an outermost second conductor layer. Each conductor layer includes metal foil, seed layer, and electrolytic plating film, t/T, t/T, u/Uand u/Uare smaller than 1, and s/Sand s/Sare larger than 1, where t, t, u, u, sand sare electrolytic plating film thicknesses of the first and second and outermost and inner first and second conductor layers, T, T, U, U, Sand Sare metal foil thicknesses of the first and second and outermost and inner first and second conductor layers.