This inventor holds 72 USPTO granted patents and 3 published patent applications and 13 EPO patents, primarily in Printed Circuit Boards (CPC class H01L). Top assignees: Ibiden Company Limited, Ibiden USA R&d Inc., Intel Corporation. Active years: 2003-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Inventors with similar research interests:
Location History:
- Gifu, JP (2004 - 2011)
- Rancho Palos Verdes, CA (US) (2011 - 2014)
- Torrance, CA (US) (2012 - 2014)
- Ibi-gun, JP (2004 - 2016)
- Ogaki, JP (2003 - 2017)
Company Filing History:
71 out of 1,483 
1 out of 1 
1 out of 56,365 
Years Active: 2003-2017
Areas of Expertise:
Title: Innovations of Dongdong Wang: A Leader in Semiconductor Technologies
Introduction
Dongdong Wang, an accomplished inventor based in Ibi-gun, Japan, has made significant contributions to the field of semiconductor technologies, holding an impressive total of 72 patents. His inventive work focuses on enhancing electronic devices through innovative wiring techniques and materials, which have had a profound impact on the industry.
Latest Patents
Among Wang's latest patents is the Flex-Rigid Wiring Board. This invention features a flexible substrate augmented by two non-flexible substrates, allowing for increased versatility in electronic device design. The unique insulation layers laminated to the respective substrates expose sections of the flexible substrate, enabling a flexible connection between rigid portions. The design also incorporates heat dissipating materials for improved thermal management, a crucial aspect in modern electronics.
Another noteworthy invention is the Semiconductor Element patent, which describes a multilayer device integrating a resin layer with an advanced semiconductor device. This device efficiently connects electronic components through a passivation layer and includes a buildup layer for enhanced functionality. The resin materials utilized range from thermosetting to thermoplastic, showcasing Wang's innovative approach to electronic manufacturing.
Career Highlights
Throughout his illustrious career, Dongdong Wang has worked with prestigious companies such as Ibiden Company Limited and Intel Corporation. His tenure at these organizations has enabled him to pioneer advancements in electronic components and wiring technologies, solidifying his reputation as a leader in semiconductor innovations.
Collaborations
Wang has collaborated with esteemed colleagues, including Motoo Asai and Hajime Sakamoto, further enriching the landscape of semiconductor research and development. These collaborations have allowed for the sharing of knowledge and expertise, propelling innovations that benefit the entire industry.
Conclusion
Dongdong Wang's contributions to semiconductor technology are significant, with numerous patents underscoring his role as a pioneer in the field. His latest innovations, including the Flex-Rigid Wiring Board and the Semiconductor Element, demonstrate his commitment to advancing electronic design and manufacturing. As the industry continues to evolve, Wang's work will undoubtedly inspire future generations of inventors and engineers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile