The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Apr. 19, 2011
Applicants:

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Takahiro Mori, Ibi-gun, JP;

Inventors:

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Takahiro Mori, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.


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