The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2014

Filed:

Sep. 25, 2009
Applicants:

Yasushi Inagaki, Ibi-gun, JP;

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Hideo Yabashi, Ibi-gun, JP;

Seiji Shirai, Ibi-gun, JP;

Inventors:

Yasushi Inagaki, Ibi-gun, JP;

Motoo Asai, Ibi-gun, JP;

Dongdong Wang, Ibi-gun, JP;

Hideo Yabashi, Ibi-gun, JP;

Seiji Shirai, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board includes a core substrate having an opening portion, an electronic component provided in the opening portion of the core substrate and including a dielectric body, a first electrode formed over the dielectric body, and a second electrode formed over the dielectric body such that the dielectric body is interposed between the first electrode and the second electrode, and a resin filling a gap between the core substrate and the electronic component in the opening portion of the core substrate. The resin filling the gap includes a filler.


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