The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Jun. 28, 2013
Ibiden Co., Ltd., Ogaki, JP;
Yasushi Inagaki, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Hideo Yabashi, Ibi-gun, JP;
Seiji Shirai, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip.