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For the Inventor, By the Inventor

Ibi-gun, Japan

Hajime Sakamoto

This inventor holds 38 USPTO granted patents, primarily in Printed Circuit Boards. Top assignees: Ibiden Company Limited, Intel Corporation, Nagoya University. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hajime Sakamoto. Retrieved from https://idiyas.com/inventor/hajime-sakamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 38

% Patents Active = 50.0

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 436(Granted Patents)


Location History:

  • Gifu-ken, JP (2003)
  • Motosu, JP (2005)
  • Gifu, JP (2005 - 2011)
  • Kawasaki, JP (2012)
  • Ibi-gun, JP (2010 - 2016)
  • Ogaki, JP (2010 - 2020)

Company Filing History:

goldMedal37 out of 1,483 
 
Ibiden Company Limited
 patents
silverMedal1 out of 56,290 
 
Intel Corporation
 patents
bronzeMedal1 out of 371 
 
Nagoya University
 patents
where one patent can have more than one assignee

Years Active: 2003-2020

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Areas of Expertise:
Printed Wiring Board
Wiring Substrate
Multilayer Wiring Board
Semiconductor Element
Interposer
PCB Manufacturing
Embedded Components
Microelectronic Device
Wafer-Level Adhesion
Adjustable Capacitance
Thermal Management
Electronic Components
38 patents (USPTO):Explore Patents
1. 10804191 - Printed wiring board (2020-10-13),
2. 10186486 - Wiring board (2019-01-22),
3. 10090238 - Wiring substrate and method for manufacturing the same (2018-10-02),
4. 9893016 - Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same (2018-02-13),
5. 9837342 - Multilayer wiring board and method for manufacturing same (2017-12-05),
6. 9711439 - Printed wiring board and method for manufacturing the same (2017-07-18),
7. 9706663 - Printed wiring board, method for manufacturing the same and semiconductor device (2017-07-11),
8. 9420697 - Method for manufacturing printed wiring board (2016-08-16),
9. 9245838 - Semiconductor element (2016-01-26),
10. 8997344 - Method for manufacturing interposer (2015-04-07),
11. 8959756 - Method of manufacturing a printed circuit board having an embedded electronic component (2015-02-24),
12. 8822323 - Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board (2014-09-02),
13. 8524535 - Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board (2013-09-03),
14. 8453323 - Printed circuit board manufacturing method (2013-06-04),
15. 8438727 - Multilayer printed circuit board and multilayer printed circuit board manufacturing method (2013-05-14),

Title: Inventor Hajime Sakamoto: Revolutionizing Technology in Ibi-gun

Introduction: Hajime Sakamoto is a visionary inventor based in Ibi-gun, Japan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Sakamoto holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his innovative spirit and commitment to advancing technology.

Career Highlights: With over two decades of experience in research and development, Sakamoto has led numerous projects that have resulted in cutting-edge technological solutions with real-world applications.

Collaborations: Throughout his career, Sakamoto has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life and make a lasting impact on the industry.

Conclusion: Hajime Sakamoto's dedication to innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field of inventing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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