The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Oct. 01, 2009
Hajime Sakamoto, Ibi-gun, JP;
Tadashi Sugiyama, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Hajime Sakamoto, Ibi-gun, JP;
Tadashi Sugiyama, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.