The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Sep. 16, 2011
Hajime Sakamoto, Ibi-gun, JP;
Tadashi Sugiyama, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Hajime Sakamoto, Ibi-gun, JP;
Tadashi Sugiyama, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component.