The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jul. 27, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventor:

Hajime Sakamoto, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/367 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15313 (2013.01);
Abstract

A multilayer wiring board includes a main wiring board which mounts a semiconductor component on a surface of the main wiring board, and a wiring structure body which is mounted to the main wiring board and is formed to be electrically connected to the semiconductor component. The wiring structure body includes conductive pads formed on a first side of the wiring structure body, a heat radiation component formed on a second side of the wiring structure body on the opposite side with respect to the first side, an insulation layer positioned between the conductive pads and the heat radiation component, and via conductors formed in the insulation layer such that each of the via conductors has a diameter which increases from the first side toward the second side of the wiring structure body.


Find Patent Forward Citations

Loading…