The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Aug. 31, 2015
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Hajime Sakamoto, Ogaki, JP;

Masatoshi Kunieda, Ogaki, JP;

Makoto Terui, Ogaki, JP;

Takashi Kariya, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/5385 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01); H05K 1/141 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10674 (2013.01); Y02P 70/611 (2015.11);
Abstract

A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.


Find Patent Forward Citations

Loading…