The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jul. 08, 2022
Applicant:
Ibiden Co., Ltd., Gifu, JP;
Inventor:
Yoshinori Takenaka, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/186 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10977 (2013.01);
Abstract
A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the inter-wiring distance between the closest two wirings of the wirings in the embedded wiring layer is in the range of 2 μm to 8 μm, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the inter-wiring distance.