The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Mar. 26, 2024
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Yoshiki Matsui, Ogaki, JP;

Atsushi Deguchi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 1/09 (2013.01); H05K 3/4007 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 2201/2081 (2013.01);
Abstract

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, bumps including a first bump and a second bump such that the first bump is formed on the first conductor pad of the conductor layer and that the second bump is formed on the second conductor pad of the conductor layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.


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