The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Jan. 31, 2023
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Kiyoteru Otomi, Ogaki, JP;

Katsutoshi Ito, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/0271 (2013.01); H05K 3/0094 (2013.01); H05K 3/4644 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H05K 1/115 (2013.01); H05K 3/0038 (2013.01); H05K 3/429 (2013.01); H05K 2201/0959 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A wiring substrate includes a core substrate including a core insulating layer, a first conductor layer, a second conductor layer, a first insulating layer, a second insulating layer, a third conductor layer, and a fourth conductor layer. The first conductor layer includes first land and first plane parts, the second conductor layer includes second land and second plane parts, the third conductor layer includes fine wirings and a third plane part, the fourth conductor layer includes fine wirings and a fourth plane part, the substrate includes a through-hole conductor connecting the first and second land parts through the core insulating layer, a first via conductor connecting the first land part and third conductor layer, a second via conductor connecting the second land part and fourth conductor layer, a third via conductor connecting the first and third plane parts, and a fourth via conductor connecting the second and fourth plane parts.


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