Gifu, Japan

Yasuji Hiramatsu

This inventor holds 54 USPTO granted patents and 1 published patent application and 5 EPO patents, primarily in Printed Wiring Boards (CPC class H05B). Top assignee: Ibiden Company Limited. Active years: 1993-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuji Hiramatsu. Retrieved from https://idiyas.com/inventor/yasuji-hiramatsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 54 

% Patents Active = 77.8

 

Average Co-Inventor Count = 2.0

ph-index = 14

Forward Citations = 588(Granted Patents)

Forward Citations (Not Self Cited) = 529(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Ohgaki, JP (1993)
  • Gihu, JP (2003 - 2010)
  • Gifu, JP (2000 - 2012)
  • Ibi-gun, JP (2003 - 2013)

Company Filing History:


Years Active: 1993-2013

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Areas of Expertise:
Printed Wiring Board
Ceramic Substrate
Laser Machining
Semiconductor Production
Multi-Layer Boards
Manufacturing Method
Electrostatic Chuck
Hot Plate
Aluminum Nitride
Sintered Compact
Inspection Devices
54 patents (USPTO):Explore Patents

Title: Yasuji Hiramatsu: Innovator in Printed Wiring Board Technologies

Introduction

Yasuji Hiramatsu is a distinguished inventor based in Gifu, Japan, known for his significant contributions to the field of electronic devices and printed wiring board technologies. With an impressive portfolio of 54 patents, Hiramatsu has been at the forefront of innovation in his industry.

Latest Patents

His latest patents showcase advanced methodologies and technologies in printed wiring boards, focusing on efficiency and enhanced functionality. One notable patent describes a printed wiring board that incorporates an insulating resinous substrate equipped with an aperture unit, a first terminal unit, a second terminal unit formed by a conductor, and a fuse unit that connects the terminal units. This design includes unique features such as a porous inorganic covering material that provides insulation over the fuse unit.

Another significant invention is a method for manufacturing printed circuit boards, which involves laminating an interlaminar insulating layer on a conductor circuit created from an electroless plated film and an electrolytic plated film, complemented by a roughened surface layer on part of the conductor circuit.

Career Highlights

Hiramatsu currently works at Ibiden Company Limited, where he has been instrumental in driving innovations that enhance the capabilities of printed wiring boards. His work is characterized by a deep understanding of both materials science and electrical engineering, allowing him to develop cutting-edge solutions that meet the evolving needs of electronic devices.

Collaborations

Throughout his career, Yasuji Hiramatsu has collaborated with other talented individuals in the field, including coworkers Yasutaka Ito and Motoo Asai. These partnerships have contributed to the development of groundbreaking technologies and have fostered a collaborative spirit within the company.

Conclusion

Yasuji Hiramatsu stands out as a leading inventor whose work in printed wiring board technology is shaping the future of electronic devices. With a strong portfolio of patents and a commitment to innovation at Ibiden Company Limited, Hiramatsu continues to make significant contributions to the field, paving the way for advancements that will benefit both industry and consumers alike.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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