The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2012
Filed:
Dec. 17, 1997
Applicants:
Motoo Asai, Gifu, JP;
Yasuji Hiramatsu, Gifu, JP;
Yoshinori Wakihara, Gifu, JP;
Kazuhito Yamada, Gifu, JP;
Inventors:
Motoo Asai, Gifu, JP;
Yasuji Hiramatsu, Gifu, JP;
Yoshinori Wakihara, Gifu, JP;
Kazuhito Yamada, Gifu, JP;
Assignee:
Ibiden Co., Ltd., Gifu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2005.12);
U.S. Cl.
CPC ...
Abstract
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
Asai, Motoo. (2012). Printed wiring board and method for manufacturing the same (U.S. Patent No. RE43509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/RE43509
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile