The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Mar. 21, 2008
Applicants:
Yasuji Hiramatsu, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Naohiro Hirose, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Inventors:
Yasuji Hiramatsu, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Naohiro Hirose, Ibi-gun, JP;
Takashi Kariya, Ibi-gun, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.