The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7456372 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 25, 2008

Filed:

Aug. 23, 2004
Applicant:

Yasuji Hiramatsu, Ibi-gun, JP;

Inventor:

Yasuji Hiramatsu, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2006.01); B23K 26/03 (2006.01); B23K 26/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the COlaser oscillator () is converted to the shortened wavelength beam by a tellurium crystal () to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.


Find Patent Forward Citations

Hiramatsu, Yasuji. (2008). Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board (U.S. Patent No. 7456372). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7456372

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