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For the Inventor, By the Inventor

Ogaki, Japan

Michimasa Takahashi

This inventor holds 72 USPTO granted patents and 14 published patent applications and 6 EPO patents, primarily in Wiring Board Technology (CPC class H05K). Top assignees: Ibiden Company Limited, Nokia Corporation. Active years: 2009-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michimasa Takahashi. Retrieved from https://idiyas.com/inventor/michimasa-takahashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 72 

% Patents Active = 66.7

 

Average Co-Inventor Count = 2.0

ph-index = 11

Forward Citations = 344(Granted Patents)

Forward Citations (Not Self Cited) = 279(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Gifu, JP (2009 - 2014)
  • Ogaki, JP (2010 - 2018)

Company Filing History:

goldMedal72 out of 1,483 
 
Ibiden Company Limited
 patents
silverMedal1 out of 8,283 
 
Nokia Corporation
 patents
where one patent can have more than one assignee

Years Active: 2009-2018

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Areas of Expertise:
Wiring Board
Flex-Rigid Wiring Board
Multilayered Printed Circuit Board
Manufacturing Method
Combined Wiring Board
Printed Wiring Board
Substrate
Multi-Piece Board
72 patents (USPTO):Explore Patents
1. 10004145 - Combined wiring board and method for manufacturing the same (2018-06-19),
2. 9844151 - Method for manufacturing combined wiring board (2017-12-12),
3. 9750136 - Wiring board and method for manufacturing the same (2017-08-29),
4. 9717151 - Flex-rigid wiring board (2017-07-25),
5. 9635765 - Combined wiring board and method for manufacturing combined wiring board (2017-04-25),
6. 9603238 - Combined wiring board (2017-03-21),
7. 9538663 - Combined wiring board and method for manufacturing combined wiring board (2017-01-03),
8. 9480173 - Flex-rigid wiring board and method for manufacturing flex-rigid wiring board (2016-10-25),
9. 9425137 - Wiring board (2016-08-23),
10. 9370101 - Method for plug-in board replacement and method for manufacturing multi-piece board (2016-06-14),
11. 9277655 - Combined wiring board and method for manufacturing the same (2016-03-01),
12. 9277650 - Combined wiring board and method for manufacturing the same (2016-03-01),
13. 9271405 - Flex-rigid wiring board and method of manufacturing the same (2016-02-23),
14. 9215811 - Method for manufacturing multi-piece substrate and multi-piece substrate (2015-12-15),
15. 9084381 - Method for manufacturing flex-rigid wiring board (2015-07-14),

Title: The Innovative Journey of Michimasa Takahashi

Introduction:

Michimasa Takahashi, a visionary inventor hailing from Ogaki, Japan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Takahashi's latest patents include cutting-edge advancements in robotics, artificial intelligence, and renewable energy technologies, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights:

With a career spanning over two decades, Michimasa Takahashi has established himself as a leading figure in the tech industry. His work has not only revolutionized existing technologies but has also paved the way for future developments in various sectors.

Collaborations:

Throughout his career, Takahashi has collaborated with top research institutions, leading companies, and brilliant minds in the industry. These collaborations have been instrumental in bringing his innovative ideas to life and turning them into tangible solutions.

Conclusion:

In conclusion, Michimasa Takahashi's relentless pursuit of innovation and his passion for creating technologies that make a difference have solidified his position as a trailblazer in the world of inventions. His work continues to inspire and shape the future of technology for generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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