The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Sep. 22, 2014
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Teruyuki Ishihara, Ogaki, JP;

Michimasa Takahashi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/368 (2013.01); H05K 3/0097 (2013.01); H05K 2201/10598 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/1484 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.


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