The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Nov. 16, 2011
Applicant:
Michimasa Takahashi, Ogaki, JP;
Inventor:
Michimasa Takahashi, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 1/183 (2013.01); H05K 3/4691 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0218 (2013.01); H05K 3/4602 (2013.01); H05K 3/4652 (2013.01); H05K 3/4664 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09536 (2013.01); H05K 2203/308 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49158 (2015.01);
Abstract
A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.