The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
Nov. 11, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Michimasa Takahashi, Ogaki, JP;
Teruyuki Ishihara, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/14 (2013.01); H05K 1/183 (2013.01); H05K 3/0097 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/209 (2013.01); H05K 2203/0169 (2013.01);
Abstract
A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.