The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Nov. 12, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Teruyuki Ishihara, Ogaki, JP;
Michimasa Takahashi, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/00 (2013.01); H05K 3/0097 (2013.01); H05K 2201/096 (2013.01); H05K 2201/10545 (2013.01); H05K 2203/0169 (2013.01); H05K 2203/167 (2013.01); Y10T 29/49124 (2015.01);
Abstract
A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.