The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Dec. 12, 2016
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Michimasa Takahashi, Ogaki, JP;

Katsutoshi Kitagawa, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/09 (2013.01); H05K 3/0011 (2013.01); H05K 3/4007 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 2201/095 (2013.01);
Abstract

A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.


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