The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Aug. 21, 2014
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Teruyuki Ishihara, Ogaki, JP;

Michimasa Takahashi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0097 (2013.01); H05K 3/0032 (2013.01); H05K 3/0052 (2013.01); H05K 3/3494 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/10424 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.


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