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For the Inventor, By the Inventor

Okazaki, Japan

Naohiko Hirano

This inventor holds 17 USPTO granted patents. Top assignees: Denso Corporation, Senju Metal Industry Co., Ltd., Nippon Soken, Inc.. Active years: 2002-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Naohiko Hirano. Retrieved from https://idiyas.com/inventor/naohiko-hirano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 94.1

Average Co-Inventor Count = 3.8

ph-index = 8

Forward Citations = 176(Granted Patents)


Location History:

  • Okazaki, JP (2002 - 2018)
  • Kariya, JP (2018)

Company Filing History:

goldMedal17 out of 20,407 
 
Denso Corporation
 patents
silverMedal3 out of 338 
 
Senju Metal Industry Co., Ltd.
 patents
bronzeMedal1 out of 1,600 
 
Nippon Soken, Inc.
 patents
4. 1 out of 38,912 
 
Toyota Jidosha Kabushiki Kaisha
 patents
where one patent can have more than one assignee

Years Active: 2002-2018

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17 patents (USPTO):Explore Patents
1. 10081852 - Solder preform and a process for its manufacture (2018-09-25),
2. 10002841 - Semiconductor device (2018-06-19),
3. 9269576 - Silicon carbide semiconductor substrate and method for manufacturing same (2016-02-23),
4. 7800230 - Solder preform and electronic component (2010-09-21),
5. 7793820 - Solder preform and a process for its manufacture (2010-09-14),
6. 7468318 - Method for manufacturing mold type semiconductor device (2008-12-23),
7. 7345369 - Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same (2008-03-18),
8. 7239016 - Semiconductor device having heat radiation plate and bonding member (2007-07-03),
9. 7235876 - Semiconductor device having metallic plate with groove (2007-06-26),
10. 7193326 - Mold type semiconductor device (2007-03-20),
11. 7145254 - Transfer-molded power device and method for manufacturing transfer-molded power device (2006-12-05),
12. 7019395 - Double-sided cooling type semiconductor module (2006-03-28),
13. 6927167 - Method for manufacturing semiconductor device having controlled surface roughness (2005-08-09),
14. 6917103 - Molded semiconductor power device having heat sinks exposed on one surface (2005-07-12),
15. 6884953 - Switching circuit (2005-04-26),

Title: Naohiko Hirano: Pioneering Inventor from Okazaki

Introduction: Naohiko Hirano is a distinguished inventor hailing from Okazaki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Naohiko Hirano holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With over two decades of experience in the tech industry, Naohiko Hirano has worked with renowned research institutions and leading tech companies, playing a pivotal role in the development of cutting-edge technologies that have revolutionized various sectors.

Collaborations: Throughout his career, Naohiko Hirano has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge exchange that has led to the creation of transformative inventions.

Conclusion: Naohiko Hirano's passion for innovation, coupled with his relentless pursuit of technological excellence, has solidified his reputation as a visionary inventor whose work continues to inspire future generations of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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