The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Dec. 11, 2003
Yutaka Fukuda, Kariya, JP;
Naohiko Hirano, Okazaki, JP;
Chikage Noritake, Ama-gun, JP;
Shoji Miura, Nukata-gun, JP;
Yutaka Fukuda, Kariya, JP;
Naohiko Hirano, Okazaki, JP;
Chikage Noritake, Ama-gun, JP;
Shoji Miura, Nukata-gun, JP;
Denso Corporation, Kariya, JP;
Abstract
A method for manufacturing a semiconductor device with a substrate having a device layer and a backside electrode is disclosed. Here, a surface roughness of the substrate is defined as a ratio between a substantial area and a projected area. The method includes polishing and wet-etching a backside surface of the substrate mechanically with using predetermined abrasive grains so that a surface roughness of the backside surface of the substrate becomes to be equal to or larger than 1.04, and forming the backside electrode on the backside surface of the substrate after polishing and wet-etching the backside surface of the substrate.