The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Apr. 26, 2007
Naohiko Hirano, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Tomomi Okumura, Aichi-ken, JP;
Kaichi Tsuruta, Tochigi-ken, JP;
Minoru Ueshima, Matsudo, JP;
Takashi Ishii, Mouka, JP;
Naohiko Hirano, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Tomomi Okumura, Aichi-ken, JP;
Kaichi Tsuruta, Tochigi-ken, JP;
Minoru Ueshima, Matsudo, JP;
Takashi Ishii, Mouka, JP;
DENSO CORPORATION, Kariya, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.