Kariya, Japan

Tomomi Okumura

This inventor holds 29 USPTO granted patents and 8 published patent applications and 6 EPO patents, primarily in Semiconductor Technology. Top assignees: Denso Corporation, Toyota Jidosha Kabushiki Kaisha, Senju Metal Industry Co., Ltd.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomomi Okumura. Retrieved from https://idiyas.com/inventor/tomomi-okumura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 86.2


Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 81(Granted Patents)


Location History:

  • Nukata-gun, JP (2007)
  • Aichi-ken, JP (2010)
  • Toyota, JP (2014 - 2016)
  • Anjo, JP (2015 - 2016)
  • Chiryu, JP (2015 - 2023)
  • Kariya, JP (2017 - 2023)

Company Filing History:


Years Active: 2007-2026

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Areas of Expertise:
Semiconductor Device
Power Module
Semiconductor Package
Terminal Connection Structure
Electric Power Converting Device
Solder Preform
Bonding Member
Semiconductor Apparatus
Manufacturing Method
Semiconductor Module
Encapsulant Resin
Comparative Tracking Index
29 patents (USPTO):Explore Patents

Title: **The Innovative Contributions of Tomomi Okumura**

Introduction

Tomomi Okumura, a notable inventor based in Kariya, Japan, has made significant strides in the field of semiconductor technology. With a remarkable portfolio comprising 24 patents, Okumura's inventions reflect a keen understanding of semiconductor devices and their applications in modern electronics.

Latest Patents

Among Okumura's latest patents are groundbreaking advancements in semiconductor devices. One patent outlines a semiconductor device that features a semiconductor chip with both an active area and an outer peripheral area. It incorporates a metal member with a mounting portion for the chip, joined by a connecting member and protected by a sealing resin body. This invention notably includes an adhesive portion that enhances the overall functionality and reliability of the device.

Another recent patent involves a semiconductor package enhanced with additional materials boasting a higher comparative tracking index (CTI) than encapsulant resin material, strategically located between two terminals. This innovation includes various components such as switching elements and metal members, all designed to optimize performance and improve safety in semiconductor applications.

Career Highlights

Okumura's professional journey includes significant positions at prominent companies such as Toyota Motor Corporation and Denso Corporation. These roles allowed him to engage deeply with cutting-edge technologies, contributing to the development of advanced semiconductor solutions that have had a lasting impact on the automotive industry and beyond.

Collaborations

Throughout his career, Tomomi Okumura has collaborated with esteemed colleagues, including Takuya Kadoguchi and Masayoshi Nishihata. These cooperative efforts have facilitated the exchange of innovative ideas and accelerated the development of high-quality semiconductor technologies that enhance device performance and reliability.

Conclusion

In conclusion, Tomomi Okumura's extensive contributions to semiconductor technology through his 24 patents exemplify his dedication to innovation. His work, characterized by a focus on enhancing device functionality and safety, continues to influence the landscape of electronics and serves as an inspiration for aspiring inventors in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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