The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Nov. 08, 2023
Denso Corporation, Kariya-city, JP;
Shoichiro Omae, Kariya-city, JP;
Tomomi Okumura, Kariya-city, JP;
Takanori Kawashima, Kariya-city, JP;
DENSO CORPORATION, Kariya-city, JP;
Abstract
A semiconductor device is to be arranged adjacent to a cooler in a predetermined direction. The semiconductor device includes a semiconductor element having main electrodes on opposite faces thereof, first and second substrates interposing the semiconductor element therebetween, and a conductive spacer interposed between the second substrate and the semiconductor element. Each of the first and second substrates includes an insulating base member, a front-face metal body connected to a corresponding main electrode, and a back-face metal body. A thickness of a part of the semiconductor device on the first substrate side from the semiconductor element is referred to as T, and a thickness of a part of the semiconductor device on the second substrate side from the semiconductor element is referred to as T. A relationship of T≥Tis satisfied.