The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Jan. 15, 2015
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;
Denso Corporation, Kariya-shi, Aichi, JP;
Takuya Kadoguchi, Toyota, JP;
Takahiro Hirano, Toyota, JP;
Takanori Kawashima, Anjo, JP;
Keita Fukutani, Kariya, JP;
Tomomi Okumura, Kariya, JP;
Masayoshi Nishihata, Kariya, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;
Denso Corporation, Kariya-shi, Aichi, JP;
Abstract
The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.