The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Jun. 03, 2004
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
Naohiko Hirano, Okazaki, JP;
Nobuyuki Kato, Nisshin, JP;
Takanori Teshima, Okazaki, JP;
Yoshitsugu Sakamoto, Toyohashi, JP;
Shoji Miura, Nukata-gun, JP;
Akihiro Niimi, Nagoya, JP;
DENSO Corporation, Kariya, JP;
Abstract
A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.