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For the Inventor, By the Inventor

Okazaki, Japan

Takanori Teshima

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Technology. Top assignee: Denso Corporation. Active years: 2002-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takanori Teshima. Retrieved from https://idiyas.com/inventor/takanori-teshima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18

% Patents Active = 77.8

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 193(Granted Patents)


Company Filing History:

goldMedal18 out of 20,494 
 
Denso Corporation
 patents

Years Active: 2002-2018

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Areas of Expertise:
Semiconductor Device
Surface Electrodes
Heat Radiation Plate
Mold Type
Transfer-Molded Power Device
Heat Sinks
Cooling Module
Radiation Structure
Insulated Gate Bipolar Transistor
Manufacturing Method
Semiconductor Module
Power Device
18 patents (USPTO):Explore Patents
1. 10079226 - Semiconductor device (2018-09-18),
2. 8963315 - Semiconductor device with surface electrodes (2015-02-24),
3. 8441122 - Semiconductor device having semiconductor chip and metal plate (2013-05-14),
4. 8125781 - Semiconductor device (2012-02-28),
5. 7944045 - Semiconductor module molded by resin with heat radiation plate opened outside from mold (2011-05-17),
6. 7468318 - Method for manufacturing mold type semiconductor device (2008-12-23),
7. 7193326 - Mold type semiconductor device (2007-03-20),
8. 7145254 - Transfer-molded power device and method for manufacturing transfer-molded power device (2006-12-05),
9. 7049688 - Semiconductor device having a pair of heat sinks and method for manufacturing the same (2006-05-23),
10. 7019395 - Double-sided cooling type semiconductor module (2006-03-28),
11. 7009292 - Package type semiconductor device (2006-03-07),
12. 7009284 - Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element (2006-03-07),
13. 6963133 - Semiconductor device and method for manufacturing semiconductor device (2005-11-08),
14. 6946730 - Semiconductor device having heat conducting plate (2005-09-20),
15. 6917103 - Molded semiconductor power device having heat sinks exposed on one surface (2005-07-12),

Title: Innovator Takanori Teshima: Pioneering Semiconductor Technologies in Okazaki, JP

Introduction

Takanori Teshima is an esteemed inventor located in Okazaki, Japan, known for his significant contributions to the field of semiconductor technology. With a remarkable record of 18 patents, Teshima has been instrumental in developing innovative solutions that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Among his latest advancements are groundbreaking patents focused on semiconductor devices. One of his notable inventions is a semiconductor device that comprises at least a semiconductor module, including a semiconductor chip and a heat sink thermally connected to it. This device features a seal member that covers and seals the chip and heat sink while leaving the heat radiation surface of the heat sink exposed for optimal cooling via a refrigerant. Furthermore, an innovative opening in the seal member serves as a refrigerant path, facilitating efficient cooling.

Another remarkable patent is for a semiconductor device with surface electrodes, which includes a plate-shaped semiconductor element encapsulated by an electrically insulating resin member. Notably, this configuration allows both the front-surface and back-surface electrodes to be exposed via the outer surface of the resin member, enhancing the device's versatility and performance.

Career Highlights

Takanori Teshima has built his career at Denso Corporation, a leader in advanced automotive technologies. His inventions have significantly contributed to the company’s reputation as a forerunner in semiconductor solutions. Teshima’s dedication to innovation is reflected in his consistent output of high-quality patents, underscoring his role as a pivotal figure in the field.

Collaborations

Throughout his career, Teshima has collaborated with several talented individuals, including fellow inventors Kuniaki Mamitsu and Naohiko Hirano. These collaborations have fostered a dynamic environment for innovation, allowing them to combine expertise and push the boundaries of semiconductor technology.

Conclusion

In summary, Takanori Teshima's impressive portfolio, which includes 18 patents, showcases his commitment to advancing semiconductor technology. Through his work at Denso Corporation and collaborations with notable colleagues, Teshima continues to inspire future innovations that pave the way for enhanced electronic devices and systems. His contributions represent a vital link between innovative concepts and their practical applications in today's technology-driven world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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